ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
| Формат: | Электронный ресурс Журнал |
|---|---|
| Язык: | английский |
| Опубликовано: |
ASME
|
| Online-ссылка: | Full text available on ASME[2020-2020] |
| Примечание: | <strong>On-Campus Access:</strong> No User ID or Password Required |
|---|---|
| Объем: | 1 online resource |
| Формат: | Mode of access: Internet |
| ISBN: | 978-0-7918-8404-1 |
| Доступ: | Electronic access restricted to authorized AUW faculty, staff and students |