ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 1: Thermal Management

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Intelligent Integrated Microsystems

Photonics Packaging and Integration IV

Photonics Packaging and Integration V

Photonics Packaging and Integration VI

Photonics Packaging and Integration III

Photonics Packaging, Integration, and Interconnects VII

Photonics Packaging, Integration, and Interconnects VIII

Photonics Packaging, Integration, and Interconnects IX

Exhibiting Atrocity
door: Sodaro

Exhibiting Blackness
door: Cooks

Pictures at an Exhibition
door: Metres

Exhibiting Scotland
door: Bucciantini

Exhibiting the Past
door: Denton

Optoelectronic Interconnects VII; Photonics Packaging and Integration II

ASME 2020 Internal Combustion Engine Division Fall Technical Conference

Microsystem Technologies

Integration and Packaging of Optoelectronic Devices

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels -Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays

A Living Exhibition
door: Walker

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration

Photonics: Design, Technology, and Packaging

Apparel production management and the technical package :
door: Myers-McDevitt, Paula J
Gepubliceerd in: (2011)

Photonics for Quantum 2020

Microsystems Metrology and Inspection

Microrobotics and Microsystem Fabrication

Journal of Optical Microsystems

Optoelectronic Integrated Circuits and Packaging V

Optoelectronic Interconnects, Integrated Circuits, and Packaging

Micro-Optics: Fabrication, Packaging, and Integration

Optoelectronic Integrated Circuits and Packaging III