ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Формат: | Электронный ресурс Журнал |
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| Язык: | английский |
| Опубликовано: |
ASME
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| Online-ссылка: | Full text available on ASME[2013-2013] |
| Примечание: | <strong>On-Campus Access:</strong> No User ID or Password Required |
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| Объем: | 1 online resource |
| Формат: | Mode of access: Internet |
| ISBN: | 978-0-7918-5575-1 |
| Доступ: | Electronic access restricted to authorized AUW faculty, staff and students |