ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| 格式: | 電子 雜誌 |
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| 語言: | 英语 |
| 出版: |
ASME
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| 在線閱讀: | Full text available on ASME[2013-2013] |
| Item Description: | <strong>On-Campus Access:</strong> No User ID or Password Required |
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| 實物描述: | 1 online resource |
| 格式: | Mode of access: Internet |
| ISBN: | 978-0-7918-5575-1 |
| 訪問: | Electronic access restricted to authorized AUW faculty, staff and students |