ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Formatua: | Baliabide elektronikoa Aldizkaria |
|---|---|
| Hizkuntza: | ingelesa |
| Argitaratua: |
ASME
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| Sarrera elektronikoa: | Full text available on ASME[2013-2013] |
Antzeko izenburuak
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nork: Myers-McDevitt, Paula J
Argitaratua: (2011)
nork: Myers-McDevitt, Paula J
Argitaratua: (2011)