ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Aineistotyyppi: | Elektroninen Aikakauslehti |
|---|---|
| Kieli: | englanti |
| Julkaistu: |
ASME
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| Linkit: | Full text available on ASME[2013-2013] |
Samankaltaisia teoksia
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Tekijä: Myers-McDevitt, Paula J
Julkaistu: (2011)
Tekijä: Myers-McDevitt, Paula J
Julkaistu: (2011)