ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Formáid: | Leictreonach IRIS |
|---|---|
| Teanga: | Béarla |
| Foilsithe / Cruthaithe: |
ASME
|
| Rochtain ar líne: | Full text available on ASME[2013-2013] |
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de réir: Myers-McDevitt, Paula J
Foilsithe / Cruthaithe: (2011)
de réir: Myers-McDevitt, Paula J
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