ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Natura: | Elettronico Periodico |
|---|---|
| Lingua: | inglese |
| Pubblicazione: |
ASME
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| Accesso online: | Full text available on ASME[2013-2013] |
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