ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Формат: | Електронний ресурс Журнал |
|---|---|
| Мова: | Англійська |
| Опубліковано: |
ASME
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| Онлайн доступ: | Full text available on ASME[2013-2013] |
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за авторством: Myers-McDevitt, Paula J
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за авторством: Myers-McDevitt, Paula J
Опубліковано: (2011)