ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Định dạng: | Điện tử Tạp chí |
|---|---|
| Ngôn ngữ: | Tiếng Anh |
| Được phát hành: |
ASME
|
| Truy cập trực tuyến: | Full text available on ASME[2013-2013] |
Những quyển sách tương tự
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Bằng: Myers-McDevitt, Paula J
Được phát hành: (2011)
Bằng: Myers-McDevitt, Paula J
Được phát hành: (2011)