ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. ASME.
Trích dẫn kiểu Chicago (xuất bản lần thứ 7)ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. ASME.
Trích dẫn kiểu MLA (xuất bản lần thứ 9)ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems. ASME.
Cảnh báo: Các trích dẫn này có thể không phải lúc nào cũng chính xác 100%.