ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems

Bibliográfalaš dieđut
Materiálatiipa: Elektrovnnalaš Áigečála
Giella:eaŋgalasgiella
Almmustuhtton: ASME
Liŋkkat:Full text available on ASME[2013-2013]
Govvádus
Fuomášahttimat:<strong>On-Campus Access:</strong> No User ID or Password Required
Olgguldas hápmi:1 online resource
Materiálatiipa:Mode of access: Internet
ISBN:978-0-7918-5576-8
Beassan:Electronic access restricted to authorized AUW faculty, staff and students