ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems

Detalles Bibliográficos
Formato: Electrónico Revista
Idioma:inglés
Publicado: ASME
Acceso en liña:Full text available on ASME[2013-2013]

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