ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems
| Формат: | Електронний ресурс Журнал |
|---|---|
| Мова: | Англійська |
| Опубліковано: |
ASME
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| Онлайн доступ: | Full text available on ASME[2013-2013] |
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Photonics Packaging and Integration IV
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за авторством: Metres
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Exhibiting the Past
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за авторством: Denton
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Terahertz and Gigahertz Electronics and Photonics II
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