ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems
| Hōputu: | Tāhiko Hautaka |
|---|---|
| Reo: | Ingarihi |
| I whakaputaina: |
ASME
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| Urunga tuihono: | Full text available on ASME[2013-2013] |