ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
| التنسيق: | الكتروني دورية |
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| اللغة: | الإنجليزية |
| منشور في: |
ASME
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| الوصول للمادة أونلاين: | Full text available on ASME[2015-2015] |
| وصف المادة: | <strong>On-Campus Access:</strong> No User ID or Password Required |
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| وصف مادي: | 1 online resource |
| التنسيق: | Mode of access: Internet |
| ردمك: | 978-0-7918-5689-5 |
| وصول: | Electronic access restricted to authorized AUW faculty, staff and students |