ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
| פורמט: | אלקטרוני כתב-עת |
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| שפה: | אנגלית |
| יצא לאור: |
ASME
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| גישה מקוונת: | Full text available on ASME[2015-2015] |
| תאור פריט: | <strong>On-Campus Access:</strong> No User ID or Password Required |
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| תיאור פיזי: | 1 online resource |
| פורמט: | Mode of access: Internet |
| ISBN: | 978-0-7918-5689-5 |
| גישה: | Electronic access restricted to authorized AUW faculty, staff and students |