ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
| Formato: | Recurso Electrónico Periódico |
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| Idioma: | inglês |
| Publicado em: |
ASME
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| Acesso em linha: | Full text available on ASME[2015-2015] |
| Descrição do item: | <strong>On-Campus Access:</strong> No User ID or Password Required |
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| Descrição Física: | 1 online resource |
| Formato: | Mode of access: Internet |
| ISBN: | 978-0-7918-5689-5 |
| Acesso: | Electronic access restricted to authorized AUW faculty, staff and students |