ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Бібліографічні деталі
Формат: Електронний ресурс Журнал
Мова:Англійська
Опубліковано: ASME
Онлайн доступ:Full text available on ASME[2015-2015]
Опис
Опис примірника:<strong>On-Campus Access:</strong> No User ID or Password Required
Фізичний опис:1 online resource
Формат:Mode of access: Internet
ISBN:978-0-7918-5689-5
Доступ:Electronic access restricted to authorized AUW faculty, staff and students