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AUWConferenceProceedingsASME000942 |
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| 020 |
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|a 978-0-7918-5689-5
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| 040 |
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|a BDCtgAUW
|c BDCtgAUW
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| 245 |
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|h [electronic resource]
|a ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
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| 260 |
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|b ASME
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| 300 |
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|a 1 online resource
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| 500 |
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|a <strong>On-Campus Access:</strong> No User ID or Password Required
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| 506 |
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|a Electronic access restricted to authorized AUW faculty, staff and students
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| 538 |
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|a Mode of access: Internet
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| 856 |
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|z Full text available on ASME[2015-2015]
|u https://asmedigitalcollection.asme.org/InterPACK/InterPACK2015/volume/56895
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