ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Chi tiết về thư mục
Định dạng: Điện tử Tạp chí
Ngôn ngữ:Tiếng Anh
Được phát hành: ASME
Truy cập trực tuyến:Full text available on ASME[2015-2015]