Proceedings of the 3rd International Conference on Technical Debt
| Materyal Türü: | Elektronik Ekitap |
|---|---|
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
Association for Computing Machinery (ACM),
6/28/20
|
| Konular: | |
| Online Erişim: | Full text available on Research4Life (ACM) |