Proceedings of the 2023 Tutorial on Advanced HE Packing Methods with Applications to ML
| Materyal Türü: | Elektronik Ekitap |
|---|---|
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
Association for Computing Machinery (ACM),
11/30/23
|
| Konular: | |
| Online Erişim: | Full text available on Research4Life (ACM) |