Microelectronic Yield, Reliability, and Advanced Packaging
| Altres autors: | |
|---|---|
| Format: | Electrònic eBook |
| Idioma: | anglès |
| Publicat: |
SPIE Digital Library,
10/23/00
|
| Matèries: | |
| Accés en línia: | Full text available on Research4Life (SPIE Digital Library) |
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Inside the yield book : tools for bond market strategy /
per: Homer Sidney, et al.
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Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
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International Conference of Microelectronics: Microelectronics '92