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Microelectronics: Design, Technology, and Packaging III

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Design, Test, Integration, and Packaging of MEMS/MOEMS

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-н: Chanda, Ipshita
Хэвлэсэн: (2003)

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ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems