Photonics: Design, Technology, and Packaging

Microelectronics: Design, Technology, and Packaging III

Photonics Packaging and Integration IV

Photonics Packaging and Integration V

Photonics Packaging and Integration VI

Photonics Packaging and Integration III

Photonics Packaging, Integration, and Interconnects VII

Photonics Packaging, Integration, and Interconnects VIII

Photonics Packaging, Integration, and Interconnects IX

Design, Characterization, and Packaging for MEMS and Microelectronics

MEMS Design, Fabrication, Characterization, and Packaging

Design, Test, Integration, and Packaging of MEMS/MOEMS

Design, Characterization, and Packaging for MEMS and Microelectronics II

Optoelectronic Interconnects VII; Photonics Packaging and Integration II

Laser Diode Chip and Packaging Technology

Optoelectronic Packaging

Advanced Packaging

Paperboard Packaging

Packaging Magazine

Advanced Packaging

Paperboard Packaging

Advanced Packaging

Packaging freedom.
по: Chanda, Ipshita
Опубликовано: (2003)

Design, Test, Integration, and Packaging of MEMS/MOEMS 2001

Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration

MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly

Microelectronic Interconnects and Packages: Optical and Electrical Technologies

Popular Plastics & Packaging

Design, Fabrication, and Characterization of Photonic Devices

Journal of Applied Packaging Research | Rochester Institute of Technology

Photonic Sensing Technologies

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems