Photonics: Design, Technology, and Packaging
| Diğer Yazarlar: | |
|---|---|
| Materyal Türü: | Elektronik Ekitap |
| Dil: | İngilizce |
| Baskı/Yayın Bilgisi: |
SPIE Digital Library,
3/25/04
|
| Konular: | |
| Online Erişim: | Full text available on Research4Life (SPIE Digital Library) |
Benzer Materyaller
Photonics: Design, Technology, and Packaging III
Photonics: Design, Technology, and Packaging II
Microelectronics: Design, Technology, and Packaging
Microelectronics: Design, Technology, and Packaging II
Microelectronics: Design, Technology, and Packaging III
Photonics Packaging and Integration IV
Photonics Packaging and Integration V
Photonics Packaging and Integration VI
Photonics Packaging and Integration III
Photonics Packaging, Integration, and Interconnects VII
Photonics Packaging, Integration, and Interconnects VIII
Photonics Packaging, Integration, and Interconnects IX
Design, Characterization, and Packaging for MEMS and Microelectronics
MEMS Design, Fabrication, Characterization, and Packaging
Design, Test, Integration, and Packaging of MEMS/MOEMS
Design, Characterization, and Packaging for MEMS and Microelectronics II
Optoelectronic Interconnects VII; Photonics Packaging and Integration II
Laser Diode Chip and Packaging Technology
Optoelectronic Packaging
Advanced Packaging
Advanced Packaging
Packaging freedom.
Yazar:: Chanda, Ipshita
Baskı/Yayın Bilgisi: (2003)
Yazar:: Chanda, Ipshita
Baskı/Yayın Bilgisi: (2003)
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Popular Plastics & Packaging
Design, Fabrication, and Characterization of Photonic Devices
Journal of Applied Packaging Research | Rochester Institute of Technology
Photonic Sensing Technologies
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems