ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| 格式: | 电子 杂志 |
|---|---|
| 语言: | 英语 |
| 出版: |
ASME
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| 在线阅读: | Full text available on ASME[2013-2013] |
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由: Myers-McDevitt, Paula J
出版: (2011)
由: Myers-McDevitt, Paula J
出版: (2011)