Microelectronic Interconnects and Packages: Optical and Electrical Technologies

Microelectronics: Design, Technology, and Packaging II

Microelectronics: Design, Technology, and Packaging III

Optoelectronic Interconnects and Packaging IV

Microelectronic Packaging and Laser Processing

Optoelectronic Interconnects, Integrated Circuits, and Packaging

Photonics Packaging, Integration, and Interconnects VII

Photonics Packaging, Integration, and Interconnects VIII

Photonics Packaging, Integration, and Interconnects IX

Optoelectronic Materials, Devices, Packaging, and Interconnects

Design, Characterization, and Packaging for MEMS and Microelectronics

Microelectronic Yield, Reliability, and Advanced Packaging

Optical Interconnections

Optoelectronic Materials, Devices, Packaging, and Interconnects II

Optoelectronic Interconnects and Packaging: A Critical Review

Design, Characterization, and Packaging for MEMS and Microelectronics II

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration

Optoelectronic Interconnects VII; Photonics Packaging and Integration II

Optical Interconnects XV

Optical Interconnects XXI

Optical Interconnects XIX

Optical Interconnects XVIII

Optical Interconnections and Networks

Optical Interconnects XVI

Optical Interconnects XIV

Optical Interconnects XXII

Optical Interconnects XX

Optical Interconnects XVII

VCSELs and Optical Interconnects

Optical Switching and Optical Interconnection

Copper Interconnect Technology
за авторством: Steinbruchel, Christophy

Multilevel Interconnect Technology

Optical Interconnects in the Computer Environment

Optical Switching and Optical Interconnection II

Microelectronic Device Technology

Multilevel Interconnect Technology III

Multilevel Interconnect Technology II