In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing

Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV

Microelectronics Manufacturability, Yield, and Reliability

Microelectronic Yield, Reliability, and Advanced Packaging

In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing

In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II

Microelectronics Manufacturing and Reliability

Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing

Lasers in Microelectronic Manufacturing

Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing III

Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing II

Design, Characterization, and Packaging for MEMS and Microelectronics

Design, Process Integration, and Characterization for Microelectronics

Reliability, Testing, and Characterization of MEMS/MOEMS

Analyse & Kritik

High Yield Report

Design, Characterization, and Packaging for MEMS and Microelectronics II

Journal of Machinery Manufacture and Reliability

Reliability, Testing, and Characterization of MEMS/MOEMS III

Reliability, Testing, and Characterization of MEMS/MOEMS II

Process and Equipment Control in Microelectronic Manufacturing

Design and Process Integration for Microelectronic Manufacturing

Journal of Microelectronic Manufacturing | JommPublish

The Promise of Failure
за авторством: McNally

Constitutional Failure
за авторством: Barber

Systems Failure
за авторством: Franta

Chronic Failures
за авторством: Kierans

Sustainable Failures
за авторством: Cable

Renal Failure

Renal Failure

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V

Inside the yield book : tools for bond market strategy /
за авторством: Homer Sidney, та інші

Inside the yield book : tools for bond market strategy /
за авторством: Homer Sidney, та інші

Laser Applications in Microelectronic and Optoelectronic Manufacturing II